USB-C Gen2 Bi-directional Switch with PD?

Thanks to /u/hubsanddocks we have some internal photos of the new CableDeconn USB-C Gen2 capable bi-directional switch with power delivery.

Your help needed!

Can you help identify the TQFN-42 IC and the 10pin chips marked with “4227” and “102TC” with the “B” logo? I’ve added my best guesses below.

Analysis

This device allows sharing a USB-C monitor/hub between 2 PCs with full video (8K30), data (10Gb/s) and power delivery (PD100) switching support. Or using a single PC to connect to two monitors or other high bandwidth USB-C devices and switch between them. The device has two USB-C receptacles, and a soldered USB-C plug on a ~6-inch cable. Curiously, the unit needs 5VDC supplied by a microUSB receptacle (Why not USB-C or accept power from a separate USB-PD source?). Other than that It has 2 LEDs indicating which port is connected, and a selection switch.

Inside, the board appears to be three layer with the top layer mostly a ground plane. Key integrated circuits are:

• Nanjing Qinheng Micro (WHC) CH552G microcontroller in a SOIC-16 package which has USB-C master/slave detection, USB 2.0, and 16KB of built-in flash.
• Unidentified TQFN-42 switch (possibly by Maxim-Integrated or Diodes-Inc) with its markings burned off with a laser
• 5x SOP-10 chips labeled with a large “B” logo and the markings “4227”, and “102TC”. These look like low-speed signal switches intended to switch the USB 2.0, CC1/CC2, and SBU1/SBU2 pins. U12 is unpopulated
• Proximate to each USB-C receptacle are the following components which probably handle power delivery switching:
  • high-side mosfet? labelled 702K
  • low-side mosfet? labeled AtsHB
  • SOP-8 IC with markings “4953C”, “435M”, and “026665” with a logo that looks like a stylized M in somewhat resembling a waveform. These are probably some sort of power management IC
• Proximate to the microUSB port is power filtering including an inductor (L1), various capacitors, and a power regulator IC marked with “AS1108” which probably regulates 5VDC down to 3.3VDC.

The rear of the PCB shows another ground plane, hand soldering of the remaining wire loom and the through-hole components including two LEDs and a single momentary microswitch. A multitude a vias connect the front ground plane to the rear and there are a vias helping to route differential pair signals between the switching IC and the USB-C receptacles. There are also large rectangular solder pads under the main high speed switch chip and the power regulator for the microUSB port. These solder pads could be used for heatsinks, but adhering thermal pads to transfer heat to the chassis works too.