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台积电稳坐全球TOP10晶圆代工第一 大陆入围2家
source link: https://news.cnblogs.com/n/626809/
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今年4月份，工信部电子信息司集成电路处处长任爱光曾经介绍过国内的半导体技术水平，在设计、制造、封测领域中，国内的封测水平与国际差距最小，设计工艺已经达到了7nm，差距最大的还是半导体制造，尽管14nm逻辑工艺即将量产，但与国外仍有两代差距。在半导体制造领域，国际上最先进的还是Intel
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